Product Name
|
TOPSOIL Heat Sink Paste / Compound 500 G |
Size
|
500 Gram |
Color
|
White |
Working Temperature
|
-40℃-260℃ |
Feature | High compressibility, soft and flexible
Natural stickiness, Good thermal conductivity, High thermal conductivity Electrical isolating Very cost effective |
Application | Heat sink For LED Bulb, CPU
Between MCPCB and heat sinks. |
Heat Sink Paste / Compound 500 G
₹549.00
Heat Sink Paste / Compound used to promote better heat conduction between MCPCB and heat sink plate.
In stock
14 reviews for Heat Sink Paste / Compound 500 G
Only logged in customers who have purchased this product may leave a review.
Naveen Kumar –
Good
Manas Acharya –
Ok perfect 👍 product
IMMANUEL RAJ –
Good product
Samad Mc –
Dipen Taid –
Best
GIRISH PARIHAR –
Vikram Singh –
Good quality and good service from topsoil Led
Rajender Singh –
TopSoil –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products all the time.
J S Christopher –
Good
TopSoil –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products all the time.
SADIK TAI –
good products
TopSoil –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products and their packaging all the time.
LEA ENTERPRISES LEA ENTERPRISES –
Good Service
Seetesh Mishra –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products and their packaging all the time.
Munir Shikalgar –
Useful
Seetesh Mishra –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products and their packaging all the time.
Immanuel Raj –
Good
S D. –
TopSoil –
Thank you for you valuable feedback, that motivates us to provide better service and maintain the quality and standards of our products and their packaging all the time.